
These foams are formulated without metallic or halogenated flame retardants. The formulations also have no silicone off-gassing. Ideal for shock and padding protection in electronics applications. There is also a special foam version for PCBs, used as a self moulding shock pad between the board and hard drive. The foam has a density of 4pcf rather than the standard density of 6 pcf plus very low compression force delfection values. The foam exerts little return pressure that could bend the boards and intefere with performance. It also has low surface tack which makes stacked die cut parts easy to separate and install.
04/2011 Elite EMC Ltd E & OE
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